The University of Science and Technology Beijing (USTB) has announced the call for applications for the 2026 Chinese Government Scholarship.

The University of Science and Technology Beijing (USTB) Scholarship is funded by the Chinese Ministry of Education and covers tuition, accommodation, medical insurance, and a living stipend of Â¥3500 per month.

Eligibility Requirements

To be considered for the USTB Chinese Government Scholarship, you must:

  • be non-Chinese citizens and in good health.

Academic background and age requirements for applicants:

  • Applicants for a master’s degree must hold a bachelor’s degree and be under 35 years old.
  • Applicants for a doctoral degree must hold a master’s degree and be under 40 years old.
  • Applicants must have a certain language proficiency (mandatory):
  • For programs taught in Chinese: At least HSK Level 4.
  • For programs taught in English (if English is not the official language of the applicant’s home country): Submit an IELTS score of 6.0, a TOEFL score of 80, or other official English proficiency certificates.
  • Applicants for undergraduate programs must take the CSCA exam.

Benefits

Scholarship benefits include:

  • Tuition fees, accommodation fees, living allowance (CNY 3,000/month for master’s students; CNY 3,500/month for doctoral students), and medical insurance.

Program Duration

  • Master’s program: 2 or 3 years
  • Doctoral program: 4 years
  • Chinese Language Training
  • 1 year of Chinese language training is available for students who study in Chinese and have only passed the HSK Level 4.

Required Documents

To apply, candidates must be ready to submit the following documents.

  • Application Form
  • Academic transcripts (bachelor’s and master’s studies)
  • Personal statement (including research plan)
  • Two recommendation letters
  • Copy of passport (ordinary passport).
  • Study plan clearly stating the intended degree and major name.
  • HSK certificate or English proficiency certificate (if unavailable, please explain in the email).

Method of Application

Click Here to Apply

Application Deadline: March 15, 2026.