The School of Embedded Composite and Artificial Intelligence (SECAI) at Leipzig and Dresden Technical Universities is pleased to welcome applications for the 2026 AI Scholarship program in Germany.

The SECAI AI Scholarship is a fully funded opportunity for home and international students to pursue a Masters degree at any of the two universities.

The scholarships include a full tuition waiver, a monthly family allowance, as well as a living stipend of €11, 208 per year.

Eligibility Requirements

Students can apply for the SECAI Scholarship if they meet all of the following criteria:

  • The content of their studies, chosen specialization, or topic of the project work planned under the scholarship is closely related to the research areas of SECAI.
  • They are students in an Master program, or students in a Diplom program where they have successfully completed the first two years of Diplom studies (Grundstudium).
  • They are students of TU Dresden or Leipzig University, or they are visiting a research group at TU Dresden or Leipzig University.
  • They demonstrate an above-average academic track record, typically with a cumulative grade point average of 1.7 or better (after conversion to the German grading system). Exceptions may be made in case of adverse personal circumstances.

Benefits

ECAI AI Scholarship Germany offers:

  • Tuition
  • €934 Living Stipends
  • Mentorship
  • Industry Networking
  • Foreign students may be entitled to a monthly family allowance.

Available Programmes

The primary objective of SECAI’s scholarship program is to support highly qualified students as the next generation of AI talents during their AI studies at TU Dresden and Leipzig University:

  1. Master students at TU Dresden or University Leipzig, primarily in the following study courses:
  2. International students visiting a research group at TU Dresden or Leipzig University
  3. Students at TU Dresden or University Leipzig visiting international partners

Method of Application

  • Submit your application via the this application form: Apply here

Click Here to Apply

Application Deadline: June 30, 2026.