Applications for the 2026 Taiwan International Graduate Program (TIGP) have commenced for interested and qualified candidates.

The Taiwan International Graduate Scholarship provides adequate financial support for selected candidates including a a stipend of around NT$ 40,000/month. 

Eligibility Requirements

To be considered for the Taiwan International Graduate Scholarship, you must:

  • Be a citizen of a foreign country except except China, Taiwan, and Hong Kong.
  • Have completed a bachelor’s degree, and if applicable, a master’s degree.
  • Have good academic standing.
  • Have good proficiency of the English Language.
  • Meet the specific requirements of the particular program you choose to apply for.

Benefits

The Taiwan International Graduate Program (TIGP) offers the following benefits;

  • There is no registration fee for this Taiwan scholarship (No Tuition fee).
  • Students will get a stipend of around NT$ 40,000/month (NT$ 34,000 tax-free + NT$ 6,000 before tax) for the first year. This is around US$1,250 and US$15,000 per year.
  • Moreover,  this scholarship/stipend will be extended for one more year for students who perform well.

Required Documents

To apply, candidates must be ready to submit the following documents;

  • Graduation certificates for bachelor’s degree and, master’s degree (In English).
  • ​Transcript for B.Sc degree and, if applicable, M.Sc. degree (In English).
  • Passport
  • Taiwan Alien Resident Certificate (ARC), if applicable
  • English language proficiency certificate
  • Three recommendation letters, including one from your advisor
  • Curriculum Vitae
  • Statement of purpose
  • Abstract of your thesis, with the name of the thesis advisor and their official website. Don’t submit the entire thesis.
  • Academic Achievement (Optional)
  • Other supporting documents, e.g., GRE Scores. publications, or any other certificates etc.
  • NB: Some programs have other specific required documents, do well to check before you apply.

Method of Application

Click Here to Apply

Application Deadline: February 1, 2026.