The University of Debrecen Stipendium Hungaricum Scholarship is one of Hungary’s fully funded opportunities for international students seeking BaBachelor’s, Master’s, and Doctoral degrees.
The Stipendium Hungaricum Scholarships cover tuition fees, a monthly stipend, accommodation, and health insurance for the entire duration of your study in Hungary and does not require IELTS.
Eligibility Requirements
To apply for the Stipendium Hungaricum Scholarships, applicants must be;
- Not be an Hungarian (Be an international student)
- Be applying to an eligible undergraduate, master’s or PhD programs available at the University of Pecs
- Meet the requirement conditions for your chosen program
- Submit your application on or before the deadline.
- Be more than 18 years by August 2025.
Benefits
The Stipendium Hungaricum full scholarship includes:
- Free tuition for the entire duration of studies
- Monthly grant for students of Bachelor, Master or PhD programs
- Contribution to accommodation
- Free medical insurance for the entire duration of a BSc, MSc or PhD program
With the Stipendium Hungaricum Scholarship, you can study at the University of Debrecen for free.
Eligible Programs
Study fields covered by the Stipendium Hungaricum Scholarship:
- Agriculture
- Business
- Computing
- Engineering
- Health Sciences
- Humanities
- Medicine
- and SciencesÂ
The list of available programs vary per country.
​To check all the available programs (A – Z), please visit THIS page.
Method of Application
- Visit https://apply.stipendiumhungaricum.hu/
- Before submitting your application, please read thebCall for Application carefully (stipendiumhungaricum.hu)
- In case you are interested, contact the sending partner in your country
- With the help of the application guide, submit all the necessary application documents to the online application system of Tempus Public Foundation (TPF). The application platform will be open from November 2025.
- Select the University of Debrecen
- You are entitled to apply to two programs
Click Here to Apply
Application Deadline: January 15, 2026.
